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Item | Production Capacity | | Layer counts | 2-30 | | Material | FR-4、High-frequency、Cu-base、Al-base | | Maximum Size | 500mm X1000mm | | Board Outline Tolerance | ±0.12mm | | Board Thickness | 0.20mm--6.00mm | | Thickness Tolerance ( t≥0.8mm) | ±8% | | Insulation Layer Thickness | 0.075mm--5.00mm | | Min Line | 0.075mm | | Min Space | 0.07mm | | Outer Copper Thickness | 35um--420um | | Inner Copper Thickness | 17um--210um | | Drill Hole (Mechanical) | 0.15mm--6.35mm | | Finish Hole (Mechanical) | 0.10mm--6.30mm | | Diameter Tolerance (Mechanical) | 0.075mm | | Registration (Mechanical) | 0.05mm | | Aspect Ratio | 13:01:00 | | Solder Mask Type | LPI | | Min Soldermask Bridge | 0.08mm | | Min Soldermask Clearance | 0.07mm | | Plug Hole Diameter | 0.25mm--0.60mm | | Impedance Control Tolerance | ±10% | | Surface Finish | HASL,LF-HASL,ENIG,Imm Tin,Imm Ag,OSP ,Gold Finger | | |
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